Reliability Technology for Integrat - E-book

eBook

Reliability Technology For Integrated Circuit Packaging - ENG

Bin Zhou; Yunfei En; Si Chen

eBook

$3,580.00

Disponible

Información adicional
Sinopsis

ISBN:	9789819538850
Formato:	ePub
Idioma:	Inglés
Editorial:	Springer Nature
Tema:	Ciencia
Subtema:	Física general
Año de publicación:	2026-04-19

This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress. Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In Chinas pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing. Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of Chinas electronic information industry.

eBooks