Design-for-Test and Test Optimizati - E-book

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Design-for-test And Test Optimization Techniques For Tsv-based 3d Stacked Ics - ENG

Brandon Noia; Krishnendu Chakrabarty

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Sinopsis

ISBN:	9783319023786
Formato:	ePub
Idioma:	Inglés
Editorial:	Springer Nature
Tema:	Tecnología e ingeniería
Subtema:	Eletrónica circuitos
Año de publicación:	2013-11-19

This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.

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