Chemical-Mechanical Planarization o - E-book

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Chemical-mechanical Planarization Of Semiconductor Materials - ENG

M.R. Oliver

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Sinopsis

ISBN:	9783662062340
Formato:	Page Fidelity
Idioma:	Inglés
Editorial:	Springer Nature
Tema:	Tecnología e ingeniería
Subtema:	Ciencia de los Materiales general
Año de publicación:	2013-03-14

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

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